Tacky Soldering Fluxes
Kester is the industry leader for Tacky Soldering Fluxes (TSFs) used in ball/sphere attach of BGAs or CSPs, BGA/CSP rework, flip chip attach, or whenever a tacky flux is needed as an interconnect solution for SMDs.
Tacky Soldering Fluxes Kester is the industry leader for Tacky Soldering Fluxes (TSFs) used in ball/sphere attach of BGAs or CSPs, BGA/CSP rework, flip chip attach, or whenever a tacky flux is needed as an interconnect solution for SMDs. |
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| Flux Type | No-Clean | Water-Soluble | ||
| Formula | TSF-6522 | TSF-6502 | TSF-6592 | TSF-6850 |
| Product Characteristics | High viscosity. Ideal for sphere and pin attachment (BGA, CSP, PGA), flip chip mounting (FCAP and FCOB) and no-clean rework operations. Compatible with air or nitrogen reflow. Residue interact well with many capillary underfill materials. | Low viscosity. Ideal for sphere and pin attachment (BGA, CSP, PGA), flip chip mounting (FCAP and FCOB) and no-clean rework operations. High activity no-clean soldering for more difficult metallization. Compatible with air or nitrogen reflow. Residue interacts well with many capillary underfill materials. | Meant for ball and flip chip application with peak temperature up to 270°C (518°F) in both air and nitrogen. Heat stable and robust activator for OSP-Cu, ENIG and immersion surface finishes. | Meant for ball and flip chip application with peak temperature up to 270°C (518°F) in both air and nitrogen. The innovative package is very aggressive on a variety of lead-free surface finishes. |
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